The Metaverse Needs Standards, Too

paulkokos
When Meta (formerly Facebook) announced in October 2021 that it would be developing metaverse technologies, it prompted a flurry of speculation and attendant announcements from other companies. Beyond that, it triggered an avalanche of confusion around what exactly the metaverse is supposed to be.Nearly a year later, the concrete details…
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Streetlight Wi-Fi Hotspots: A Bright Idea

paulkokos
Wi-Fi deployed via streetlights—the vision of an international consortium founded by Intel, Facebook, Nokia and others—may one day help augment wireless access throughout cities. However, much remains unknown about the most apt placement for these access points. Now a novel algorithm could help telecommunications companies discover how to best install…
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Component-level Modeling of an Antenna onto a Satellite

paulkokos
The relationship between component and system-level modeling is significant for customers working in space applications and urban environments. This webinar will demonstrate a complete simulation workflow from the component-level modeling of an antenna to the system-level integration of the antenna onto a satellite.Register now for this free webinar!Digital mission support…
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Parasitic Extraction of MIM/MOM Capacitor Devices in Analog/RF Designs

paulkokos
The extensive use of MIM/MOM capacitors in analog/RF designs presents parasitic extraction challenges to designers. Understanding best practices and recommended tools for extracting the complex geometries of capacitor devices, as well as the in-context coupling effects for those devices in sensitive analog/RF blocks, enables designers to accurately apply the appropriate…
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Video Friday: Make This Face

paulkokos
Video Friday is your weekly selection of awesome robotics videos, collected by your friends at IEEE Spectrum robotics. We also post a weekly calendar of upcoming robotics events for the next few months. Please send us your events for inclusion.CLAWAR 2022: 12–14 September 2022, AZORES, PORTUGALIROS 2022: 23–27 October 2022,…
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Proposed Standardization of Chiplet Models for Heterogeneous Integration

paulkokos
As general purpose chiplet providers offer their devices for use in heterogeneous package designs, manufacturers need a standardized set of design models to ensure operability in electronic design automation (EDA) design workflows. For successful industry-wide 3D IC packaging, these models should be: Electronically readable for use in design workflows Leverage…
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Delivering 3D IC Innovations Faster

paulkokos
One of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, more companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets (implemented in different processes…
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