DARPA’s Electronics Resurgence Initiative—a US $1.5-billion five-year effort to remake the U.S. electronics industry as the era of Moore’s Law comes to a close—recently unveiled the scientists, companies, and institutions who are getting its first dose of funds. Among the 42 projects, one stands out for the size of the award.

At $61 million, the Revolutionizing Computing Systems through Dense and Fine-Grained Monolithic 3D Integration project, is the largest on the list by nearly $40 million. And its goal is just as outsized: To use monolithic 3D integration to make chips made using decades-old fabrication processes competitive with chips made using today’s bleeding edge technologies.