How Multiphysics Simulation Can Analyze Electronics Cooling Problems

The impact of increasingly powerful electronics on our society continues to grow. The significant heat produced by today’s electronics must be dissipated to prevent premature component failure.

Engineers that design electronics face significant thermal management challenges, and the number of applications that require thermal management continues to grow. Cellphones, data centers, home electronics, telecommunication, and the electrical grid use electronic components that require thermal management. To keep up with the increasing demand of technology users today, engineers must increase the power of critical electronic components. Keeping these components cool represents a significant design challenge. This design task becomes even more challenging as methods for thermal management increase in complexity.

One solution to this engineering challenge is to use multiphysics simulation software to improve the accuracy of the engineer’s calculations in comparison to analytic and single-physics solutions. These simulations include heat generated by the component, air/liquid/gas flow around the component, and radiative heat transfer from the component. Heat generation due to resistive heating in the board can be included with heat generated from components to determine the heat generated within the system.

Air/liquid/gas flow through the system, due to either forced or natural convection, can also be analyzed. For many systems, radiation also must be considered for accurate temperature predictions due to the large amount of heat transfer that occurs via this mechanism in many electronic designs.

In this presentation, guest speakers Kyle Koppenhoefer and Joshua Thomas from AltaSim Technologies will discuss an electronics cooling problem subjected to a complex thermal environment. The webinar will also include a live demo in the COMSOL Multiphysics software and a Q&A session.

Speakers

Kyle Koppenhoefer
President
AltaSim Technologies
Kyle Koppenhoefer is the president of AltaSim Technologies. He and his business partner founded AltaSim 18 years ago. He works with customers to identify how computational analysis can be used to provide solutions to their products and manufacturing processes. Prior to cofounding AltaSim, Kyle worked for the Department of Defense and the Edison Welding Institute. He holds a PhD in civil engineering from the University of Illinois.

Joshua Thomas
Senior Engineer
AltaSim Technologies
Joshua Thomas is a senior engineer at AltaSim Technologies. He has provided consulting and training support in COMSOL Multiphysics® over the last 10 years. He is a lead instructor in many of AltaSim’s classes and has worked extensively with structural mechanics problems and multiphysics problems involving thermal and structural analysis. Josh received his bachelor’s degree in aerospace engineering and master’s degree in mechanical engineering from The Ohio State University

Jaymin Patel
Applications Engineer
COMSOL
Jaymin Patel is an applicatons engineer at COMSOL. His focus is on products related to CFD, heat transfer, and chemical engineering. He received his master’s degree in chemical engineering from the Georgia Institute of Technology.

Source: IEEE Spectrum Computing